XY Capital Ltd Buys New Shares in ChipMOS TECHNOLOGIES INC. (NASDAQ:IMOS)

XY Capital Ltd purchased a new position in ChipMOS TECHNOLOGIES INC. (NASDAQ:IMOS) during the 4th quarter, Holdings Channel reports. The firm purchased 10,020 shares of the semiconductor company’s stock, valued at approximately $189,000.

Separately, Ballentine Partners LLC raised its stake in shares of ChipMOS TECHNOLOGIES by 11.6% in the 4th quarter. Ballentine Partners LLC now owns 17,348 shares of the semiconductor company’s stock valued at $327,000 after buying an additional 1,801 shares in the last quarter. Institutional investors and hedge funds own 7.39% of the company’s stock.

Analyst Ratings Changes

Separately, StockNews.com cut shares of ChipMOS TECHNOLOGIES from a “buy” rating to a “hold” rating in a research note on Tuesday, January 21st.

ChipMOS TECHNOLOGIES Trading Up 1.6 %

Shares of IMOS stock opened at $19.32 on Monday. The company has a market capitalization of $702.48 million, a P/E ratio of 13.51 and a beta of 0.85. The firm has a 50-day moving average price of $19.15 and a 200 day moving average price of $21.21. The company has a quick ratio of 2.72, a current ratio of 3.07 and a debt-to-equity ratio of 0.49. ChipMOS TECHNOLOGIES INC. has a 12-month low of $17.70 and a 12-month high of $32.19.

ChipMOS TECHNOLOGIES announced that its Board of Directors has approved a stock repurchase program on Tuesday, January 21st that allows the company to buyback $0.00 in outstanding shares. This buyback authorization allows the semiconductor company to buy shares of its stock through open market purchases. Stock buyback programs are typically a sign that the company’s board believes its shares are undervalued.

ChipMOS TECHNOLOGIES Profile

ChipMOS TECHNOLOGIES INC. engages in the research, development, manufacture, and sale of high-integration and high-precision integrated circuits, and related assembly and testing services in the People’s Republic of China, Taiwan, Japan, Singapore, and internationally. It operates through Testing; Assembly; Testing and Assembly for LCD, OLED and Other Display Panel Driver Semiconductors; Bumping; and Others segments.